The Radiation Hardened Electronics Market is anticipated to develop throughout the projected period, according to MarketsandMarketsTM's study titled "Radiation Hardened Electronics Market". According to the analysis, the market, which was estimated to be worth USD 1.5 billion in 2022, is anticipated to grow to USD 1.8 billion by 2027, representing a Compound Annual Growth Rate (CAGR) of 4.0% between 2022 and 2027. According to the report, this development can be attributed to a number of causes, including the rising demand for radiation-hardened components, especially in critical applications where dependability and longevity in harsh environments are essential. The significance of radiation-hardened electronics in a variety of fields and applications is highlighted by this predicted growth.

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The Radiation Hardened Electronics Market is expanding significantly, spurred by improvements in multicore processing technology made specifically for military and space applications. The requirement for increased processing power and reliability in demanding conditions is the main driver of this trend. Additionally, there is a rising need for electronic systems that can operate successfully under challenging nuclear settings. Given the prominence of nuclear applications and possible risks, this is especially pertinent. The growth of the market for radiation-hardened electronics is also a result of the worldwide upsurge in intelligence, surveillance, and reconnaissance (ISR) activities. The need for strong and durable electronic components to survive these demanding circumstances is growing as these activities become more common across numerous industries.

Power electronics component to hold the largest size of radiation hardened electronics market during the forecast period

Throughout the anticipated period, the size of the radiation-hardened electronics market is expected to be dominated by the power electronics component. The increasing use of MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) power electronics in high-reliability and space applications is responsible for its prominence. This increase is being fueled by MOSFET devices' exceptional resistance to ionising radiation and high-energy charged particles. MOSFET device performance is being aggressively improved by manufacturers with space applications in mind. For instance, Si MOSFET devices are provided by IR HiRel, a division of Infineon Technologies AG, which helps high-throughput satellite operations operate more efficiently and at a lower cost per bit. The R9 MOSFET type provides a wider range of gate drivers and better current-handling capabilities, which helps satellite designers even more.

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COTS in product type segment is expected to grow at the fastest CAGR during the forecast period

Within the product type category for radiation-hardened electronics, the Commercial Off-The-Shelf (COTS) segment is anticipated to grow at the fastest Compound Annual Growth Rate (CAGR) throughout the course of the forecast period. This market now holds a sizeable share, and it is expected to grow quickly. The spread of affordable nanosatellites has been crucial in boosting the growth prospects for the COTS product category. Furthermore, COTS technologies feature strong signal processing architectures, which have helped them become widely used in military space missions. A noteworthy benefit of COTS is its capacity to provide cost reductions in space applications by permitting seamless replacement with ceramic packages that are pin-out compliant and functionally identical to the original device.

North America expected to dominate the radiation hardened market during the forecast period

North America is anticipated to rule the market for radiation-hardened electronics during the anticipated time frame. Due to the rising need for radiation-hardened components for both commercial and military satellite applications, this area now retains the highest share. The Department of Defence (DoD) and different business sectors are in need of reliable radiation-hardened microelectronics to support projects like nuclear modernization and satellite programmes, and this prevalence is particularly visible in the United States. The US government is still committed to developing and maintaining domestic capabilities for producing radiation-hardened microelectronic components in order to support this industry. The approval to use Title III of the Defence Production Act (DPA), which was obtained in December 2021, serves as a tangible example of this commitment.

Key players in the radiation hardened electronics market are Microchip Technology Inc. (US), BAE Systems (UK), Renesas Electronics Corporation (Japan), Infineon Technologies AG (Germany), STMicroelectronics (Switzerland), Xilinx, Inc. (US), Texas Instruments Incorporated (US), Honeywell International Inc. (US), Teledyne Technologies Inc. (US), and TTM Technologies, Inc. (US). SMEs/startups covered in the study are Cobham Limited (UK), Analog Devices, Inc (US), Data Devices Corporation (US), 3D Plus (France), Mercury Systems, Inc. (US), PCB Piezotronics, Inc (US), Vorago (US), Micropac Industries, Inc (US), GSI technology, Inc (US), Everspin Technologies Inc (US), Semiconductor Components Industries, LLC (US), AiTech (US), Microelectronics Research Development Corporation (US), Space Micro, Inc (US), and Triad Semiconductor ( US).

News Covered:

https://www.globenewswire.com/en/news-release/2023/01/31/2598365/0/en/Global-Radiation-Hardened-Electronics-Industry-Size-is-Anticipated-to-Gain-1-8-Bn-by-2027-at-a-CAGR-of-4-0.html

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