大学英语词汇短语释义解析及例句 copper plating
释义：
copper plating 铜镀层：一种将铜覆盖在其他金属或材料表面的处理方法，通常用于提高导电性、耐腐蚀性或装饰性。
例句：
Waterproof joint made by nylon or copper plating nickel.
尼龙材质或铜镀镍防水锁。
A new non-cyanide alkaline copper plating process was introduced.
介绍了一种新的无氰碱铜工艺。
Is the copper plating process an electrolytic acid copper plating system?
电镀站是否有酸解电镀铜系统？
GRG, Copper plating, Stainless steel, Marble, Weathering steel, Custom carpet, Wood floors.
铜片，电镀不锈钢，大理石，耐候钢，定做地毯，实木地板。
Copper plating, improve electricity with: render coating adhesion ability, and corrosion ability.
镀铜：打底用，增进电镀层附着能力，及抗蚀能力。
So, to find a non-cyanide alkaline copper plating bath is a great target of the plating operator.
因此，研究出合适的无氰镀铜工艺来取代氰化镀铜工艺一直是广大电镀工作者的目标。
The inner anode and its choice for copper plating on stainless steel was emphatically introduced.
重点对不锈钢镀铜的内阳极及其选择作了介绍。
A novel technology of acidic electroless copper plating on steel matrix was studied in this paper.
研制了一种新型的钢铁基件酸性化学镀铜工艺技术。
A process for continuous copper plating on steel wire at high current densities was described in detail.
介绍了高电流密度连续生产钢芯镀铜线工艺。
Cholride ions in acid copper plating bath were determined by nephelometry with op emulsifier as stabilizer.
利用比浊法，以OP乳化剂作为稳定剂测定酸性镀铜液中的氯离子。
A kind of composite additive used for copper plating of chemical replacement on iron surface was investigated.
研究了一种用于钢铁基体化学置换镀铜的专用复合添加剂。
Copper sulfate in acid copper plating bath was determined by spectrophotometry with EDTA as chromogenic agent.
用EDTA作显色剂，通过光度法测定酸性镀铜液中硫酸铜的含量。
In this paper, the conditions of composite chemical copper plating with two solid particles ZnO and SnO are studied.
研究了氧化锌、氧化亚锡两种固体微粒复合化学镀铜的工艺条件。
The good dispersivity colloids have excellent catalysis for direct copper plating and its UV-VIS peaks are broadened.
分散性好的胶体钯溶液的紫外-可见吸收峰变宽，经过活化可以进行直接电镀。
Production of copper plating technology commonly used by a copper with copper with coke, acid, phosphate copper with etc.
生产上常用的镀铜工艺有氰化镀铜、酸性镀铜、焦磷酸盐镀铜等。
The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.
探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。
