大学英语词汇短语释义解析及例句 flip chip


释义：

flip chip 倒装法；覆晶技术

例句：



The process of flip chip based on aluminum nitride is studied.

研究了以氮化铝为基板的倒扣封装的工艺。



The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.

研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性。



The embedded active chip also can be realized by backside thinning and flip chip bonding.

通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。



Flip chip technology has become one of the major joining technologies in electronic packaging.

摘要覆晶技术已成为电子构装中之主要接合技术之一。



Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.

板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。



The system can process wafers up to 200mm in diameter and includes die inversion for flip chip applications.

该系统可以处理直径多达200毫米的晶片，包括模具的倒装。



This article presents acid could be used to wash the indium bumps before flip chip bonding, based on indium oxide dissolved in acid.

利用氧化铟易于溶于酸性溶液的性质，提出了在倒装焊接之前使用酸性溶液对铟柱进行酸洗。



This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.

本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。



Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。



An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.

IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。



Thedrain saturation current is increased 10% after bonding. To disperse heat of GaNHEMT, this flip chip bonding method seems to be simple and effective.

实验结果表明，这种改进的倒装焊技术可以使HEMT 器件的饱和漏极电流提高10%。



This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.

介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。



Electromigration induced Cu dissolution in flip chip Packages The phenomenon of Cu dissolution induced by electromigration at flip chip solder joints is reported.

覆晶封装中电迁移效应导致之铜溶解现象本論文报导覆晶封装之焊点中电迁移所引起之铜垫层快速溶解现象。