大学英语词汇短语释义解析及例句 ic chip

大学英语词汇短语释义解析及例句 ic chip


释义:

ic chip 集成电路芯片

例句:



Phase-locking loop circuit, phase shifting method, and IC chip.

锁相环电路,相移方法,及集成电路芯片。



Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备。



With the advent of the era of deep sub-micron IC, the feature size on the IC chip is shrunk to nanometers.

伴随着深亚微米集成电路时代的来临,芯片的特征尺寸已经缩小到纳米尺度。



On the front of outer packing, there's printing of "Dual Core IC Chip Inside" and all the hosts that it supports.

外包装正面有双核字样以及市面上支持所有型号的主机。



Grand scale IC chip that every important company produces at present is almost all having the boundary scan structure.

并且目前各大公司生产的超大规模集成电路芯片基本全部具有边界扫描结构。



The present invention may improve quality factor of the spiral inductor structure and integrate the same onto the IC chip.

本发明能够提高螺旋电感结构的品质因数,并可将其整合于IC芯片上。



It proves that the designed parallel bonding mechanism meets the working requirements of IC Chip Die by these characteristic curves.

根据这些曲线,说明所设计的并联焊头机构能满足IC芯片粘片机的工作要求。



It introduces the operation principle and hardware and software design of a IC chip test instrument based on AT89C52 chip microcomputer.

介绍了采用AT 89 C5 2单片机设计的集成芯片测试仪的工作原理及硬软件设计。



A video character superimposition system is designed based on the IC chip MB90092, and the design of the software for MB90092 is discussed.

基于MB90092芯片设计了视频字符叠加系统,以此为基础论述了MB90092的软件设计方法。



The test circuit receives the second clock signal and the first clock signal outputted by the first IC chip to generate a comparable signal.

检测电路接收第二时钟讯号和第一集成电路芯片所输出的第一时钟讯号,以产生一比较讯号。



AD73360 is a programmable three-phase electrical parameter measurement IC chip. It is mainly used in industry ammeter and multi-input systems.

AD 73360是一主要适用于工业电表和多路输入系统的可编程三相电量测量ic器件。



An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.

IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。



Based on these characteristic curves, it proves that the moving stiffness of the designed Parallel Bonding Mechanism meets the working requirements of IC Chip Die.

根据这些曲线,说明所设计的并联焊头机构的动刚度能满足IC芯片粘片机的工作要求。



This paper design an audio processor through circuit designing, simulation, layout designing, chip testing. PMS1345 is an I2C bus controlled audio processing IC chip.

这次毕业设计从电路设计、性能仿真、版图设计、芯片整合测试这几个方面出发,设计出一款的音频处理芯片pms1345。



The integral period sampling, which is realized by realtime frequency calculation and voltage capture function of IC chip, is necessary for precise digital signal processing.

借助芯片的捕获功能,计算信号的实时频率,实现了整周期采样,保证了数字信号处理的精度。

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